HCL announces new solution to tap 5G market

Information Technology major HCL Technologies (HCL) on Friday announced a fully configurable, flexible 5G and mobile backhaul solution for Xilinx all programmable Zynq UltraScale+ MPSoC devices.
Xilinx Zynq UltraScale+ MPSoC devices offer the perfect single-chip platform for both cost-sensitive and high-performance applications using industry-standard tools.
These devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing.
It comes with multiple processor variants, a wide range of connectivity options and programmable logic capacity, DSP architectural blocks, and on-chip memory.
The solution targets 5G access and mobile backhaul markets and will enable telecom OEMs (original equipment manufacturers) to meet the stringent requirements of next-generation networks.
Integrated backhaul and access are among the key technologies needed to enable ambitious 5G demands. The increase in capacity of the 5G radio network needs to be supported by faster and wider bandwidth backhaul that incorporates Gigabit Ethernet, optical fiber, or microwave wired and wireless point-to-point links.
Xilinx is the leading silicon provider for wireless infrastructure for digital radio front end, connectivity, baseband acceleration, fronthaul and backhaul modem and packet processing functions. The programmability and scalability of Xilinx platforms make them an ideal fit for these applications, particularly for radio, where a variety of form factors, frequencies, bandwidths and radio access technologies need to be supported.
HCL’s solutions provide a range of benefits including enhanced radio performance, increased flexibility, and portability—along with other enhanced features. Together, the HCL and Xilinx integrated solution will provide a highly configurable backhaul modem on an advanced technology node (covering the spectrum of RF bands and E-bands, to V-bands) that will result in an overall reduction in bill-of-material (BOM) cost and a significant reduction in power dissipation compared to current solutions.
Additionally, the plug and play architecture allows for custom IP to be embedded in the modem.
“Telecommunications OEMs need enhanced capabilities for 5G, which is expected to power the growth of the mobile broadband, massive IoT, and mission-critical applications,” HCL Technologies Corporate Vice President Sukamal Banerjee said.